Toshiba To Double Power Chip Production With New Plant in Japan

Toshiba will spend roughly 100 billion yen ($873 million) to build a power semiconductor fabrication facility in Japan, with production expected to begin by March 2025, Nikkei has learned. From the report: The new plant will be built on the grounds of Kaga Toshiba Electronics, a chipmaking subsidiary in Ishikawa Prefecture. Toshiba aims to meet the rise in demand for power chips -- used in automobiles, servers and industrial equipment -- that save energy and contribute to lower carbon emissions. All of the production equipment will be compatible with large 300 mm wafers. Compared with a 200 mm wafer conventionally used for power chips, one 300 mm wafer can produce more chips and boost production efficiency. Kaga Toshiba is also installing a 300 mm wafer production line at one of its existing buildings. The line is expected to begin operation between October 2022 and March 2023. Toshiba's investment for these endeavors totals around 130 billion yen. The 300 mm production lines to be installed in the old and new buildings will more than double the Japanese group's power-chip production capacity.

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