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Intel Lakefield Brings Its 3D Chip-Stacking Tech to Life

mardi 8 janvier 2019, 01:45 , par Wired: Cult of Mac
Weeks after introducing Foveros, its 3D logic stacking technology, Intel has shown off a motherboard that puts it to use.
Lire la suite sur Wired: Cult of Mac
https://www.wired.com/story/intel-lakefield
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mar. 29 avril - 15:28 CEST