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TSMC board approves $743 million bond sale to build Arizona chip fab
lundi 22 mars 2021, 22:26 , par Mac Daily News
TSMC will issue a total of NT$21.1 billion (US$743.2 million) in unsecured bonds to finance an expected $12 billion chip fab in Arizona …
The post TSMC board approves $743 million bond sale to build Arizona chip fab appeared first on MacDailyNews.
https://macdailynews.com/2021/03/22/tsmc-board-approves-743-million-bond-sale-to-build-arizona-chip-...
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