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iPhone 17 could be first to get new thinner & lighter motherboard tech
jeudi 12 octobre 2023, 20:09 , par AppleInsider
According to analyst Ming-Chi Kuo, Apple is looking to use Resin Coated Copper for the motherboard in its 2025 iPhone 17, if the technology can be perfected.A motherboard or mainboard (source: Ming-Chi Kuo)It's already been claimed that the whole iPhone 17 range will have always-on displays, but now there's a rumor about the internal design, too. Ming-Chi Kuo says that Apple aims to make its iPhone mainboard using resin coated copper (RCC). Read more...
https://appleinsider.com/articles/23/10/12/iphone-17-could-be-first-to-get-new-thinner-lighter-mothe...
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