Apple A20 chip packaging tech may give iPhone 18 more RAM, speed, and run cooler

The A20 chip that will be used in the iPhone 18 could be packaged with a new tech that will give Apple more configuration options, while still being as small as possible.Dies on wafers [TSMC]Apple's chips, produced by TSMC, are currently packaged using a method known as InFo (Integrated Fan-Out), which helps create very compact chips for use in the iPhone. However, if a leaker is to be believed, Apple could switch to something different.In a Weibo post by 'Mobile Phone Chip Expert' on Monday, it is claimed that the A20 will be a 2-nanometer chip that uses a new packaging method known as WMCM. The leaker also adds that the memory will also be upgradedto 12GB for all models. Rumor Score: