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What the PUC: SK Hynix next to join big boys in 96-layer 3D NAND land
lundi 5 novembre 2018, 17:19 , par TheRegister
Whether you Periphery Under Cell or Core Over Periphery, it all means smaller chips
SK Hynix has finished work on a 512 Gbit, 96-layer, 3D NAND chip with 1Tbit, and 3bits/cell (TLC) and 4bits/cell (QLC) coming later.…
go.theregister.com/feed/www.theregister.co.uk/2018/11/05/sk_hynix_96_layer_flash_chip/
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56 sources (32 en français)
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jeu. 21 nov. - 17:33 CET
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