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Intel Lakefield Brings Its 3D Chip-Stacking Tech to Life
mardi 8 janvier 2019, 01:45 , par Wired: Tech.
Weeks after introducing Foveros, its 3D logic stacking technology, Intel has shown off a motherboard that puts it to use.
https://www.wired.com/story/intel-lakefield
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56 sources (32 en français)
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ven. 22 nov. - 17:26 CET
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